Brief Introduction LED Chip Manufacturing Process

LED chip manufacturing process can be divided into wafer handling processes (Wafer Fabrication), wafer probe process (Wafer Probe), packaging process (Packaging), test procedures (Initial Test and Final Test). Wafer handling processes and wafer probing process is preceding (Front End) process, while packaging processes, test processes posterior segment is Back End processes.

1.       Wafer processing

The main work of this process is on the wafer production circuits and electronic components. Typically the process technology is related with the type of the products, first step is cleaning the wafer. Second, oxidizing the surface and in progress of chemical vapor deposition. Then coating, exposure, development, etching, ion implantation, sputtering a metal such as repeating step, the final layers of the wafer to complete the circuit and components processing and production.

2.       Wafer probing process

After the procedure, the wafer is formed on one of the small cell. Under normal circumstances, for ease of testing, improve efficiency, fabricated on the same wafer with a variety of product specifications. Under normal circumstances, for ease of testing, improve efficiency, fabricated on the same wafer with a variety of product specifications. But also can make several different varieties and specifications of products according to the need. In a probing (Probe) for each instrument to detect the electrical characteristics of the grain, the grain marked and unqualified after the wafer is cut. Divided into those many separate grains, then its electrical characteristics classified into different trays, unqualified grain is discarded.

3.       Packaging process

The grain is fixed on a single plastic or ceramic chip base and put some grain etched on the lead wire protruding from the bottom end of the base pin connector, to connected with the circuit board, finally covered with plastic and sealed with glue. Its purpose is to protect the grain to avoid scratching by mechanical or heat damage. This be considered fabricated an integrated circuit chip.

4.       Test procedure

Finally put a chip for the test, which can be divided into general and special test. The former is placed the chip after the package on various situation test their electrical characteristics such as power consumption, speed, pressure resistance, etc. After test the chip, according to their electrical characteristics we divided into different grades. The special test is based on the technical parameters of the special needs of our customers, from the similar parameter specifications, randomly take some part of the chip, making targeted specifically tested. To see whether it can meet customers' special needs, and in order to decide whether it is necessary for customers to design ASIC. Those products which are pass the general test can be shipped after paste products labeled specifications, model and date of manufacture and other identification labels.